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Photo etching technology is indispensable for producing semiconductor products, various electronic components and other precision parts. Photo Etching technique which is the combination of optical technique and chemical technique enables us to produce complex and fine shapes at the accuracy of micron level in a short leadtime without using expensive stamping tool.　 Available Materials, Thickness and Maximum size

Material Fe Cu SUS KOVAR Alloy42 Al Si-Steel Thickness(mm) 0.01〜2.0 0.01〜2.0 0.005〜10.0 0.05〜1.0 0.03〜1.0 0.01〜2.0 0.1〜0.5 Max size 300×500 400×600 800×1000 300×500 800×1000 800×1000 400×500 Particular material Ag MO Ti Amorphous ※ Max size varies depending on the type of materialand its thickness. Thickness(mm) 0.01〜0.2 0.05〜1.0 0.01〜0.3 0.01〜0.1 Max size 150×350 200×300 200×300 200×350 Dimensions & Tolerances Judging from the nature of etching process, dimension and tolerance are calculated by relation between thickness, type of materials and side-etching(under cutting) （1）Relation between Hole Size and Thickness As a rule, the diameter of holes or slot width cannot be smaller than the metal thickness. However, this relationship may vary as the metal thickness changes. Thickness (t) Minimum diameter of hole (D) t<0.05mm To be determined by test run t=0.05mm〜0.1mm more than 110% of metal thickness 0.1mm<t more than 100% of metal thickness （2）Minimum Dimensions and Tolerances thickness (t) Minimum dimension Tolerance 0.01mm To be determined by test To be determined by test run 0.02mm〜0.05mm To be determined by test To be determined by test run 0.1mm 0.1mm ±0.01〜0.02 0.15mm〜0.2mm 0.15mm〜0.2mm ±0.02 0.25mm 0.25mm ±0.03 0.5mm 0.4mm ±0.05 Above lists are based on our experience,but they may be changed depending on the type of material or the quantity. Please contact us at your designing phase for more information. （3）Relation between line width and metal thickness. Relation between line width and metal thickness is basically the same as 2), “Minimum Dimensions and Tolerances”.However, this relation can be also influenced by the relation between line length, width and metal thickness. Please contact us for more information at your designing phase. （4）Corner radius Corner becomes round by chemical etching. Generally outside corner radius (=r) tends to be etched more sharply than inside corner radius (=R). As a general trend, inside corner radii (=R) are considered to be 80% of the metal thickness, and outside corner radii (=r) are considered to be 50% of metal thickness or less. （5）Relation between cross-sectional shape and metal thickness （a）Single side etching Since the undercut at the edges tends to be larger, cross sectional shapes of the etched metal are tapered as in Figure (a), and tolerances are less precise. The bevel size(A) will be approx. 40% of the metal thickness(t). （b）Both sides etching The bevel size(A) is reduced to approx. 20%(t) of the metal thickness (t) or less as in Figure (b). Pitch Tolerance （1）Pitch Tolerance pitch<10mm ±0.005mm pitch=10mm〜100mm ±0.01mm pitch=100mm〜300mm ±0.01mm〜±0.03mm （2）Etching tolerance Dimensional tolerances vary with a number of factors such as the type of material, the size of panel and productivity rate. Although it is impossible to give a definite and absolute rule to cover all circumstances, a tolerance of +/-15% of metal thickness is widely accepted as a general rule of thumb. We can also meet better tolerance for small-lot production, but it may affect the cost. The dimensional tolerance will be determined after consultation with customers. ● Measuring methods We have various measuring methods and instruments, but main method is measuring by projectors.

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