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Top Page ＞ Products Index ＞ Polyimide Etching Process
polyimide etching process title
Combined Techniques Bring New Products!
Hirai can supply various parts by combiniation of new technique to etch polyimide and conventional technique to etch metals.
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Fine Polyimide (PI) Etching
● Fine polyimide forming around 50um accuracy is available.
Same process time regardless of whether the design is fine or rough.
● Half etched Forming (concave letters)
Convex letters can be also available.
Surface roughness of half etched area : Ra≒0.08μｍ
"PI and Metal sheet which are laminated together" can be etched
Lamination of various shaped metals and polyimide is available.
● PI's original heat resistance and chemical resistance.
Lamination of PI and metals offers resistance to high temperature and chemicals because of nonuse of adhesive.
● Partial insulation
Realization of low-dielectric insulating parts for various electronic / electric parts.
● “A thousand types of metals attached to PI”
can be etched into requested shape.
polyimide etching process image
through hole
■ φ0.12TH
Three-layer substrates
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■ PI films can be etched
pi films can be etched image
■ "Thick Cu + PI " substrates ■ Partial insulating SUS parts
substrates image partial insulating SUS parts image

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Etching
Process		 Polyimide Etching
Process		 LTCC
Process		 Surface
Treatment		 Machining
Process		 Lamination
Process		 Equipment Products
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