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	Response to the Semiconductor Part Needs for lamination technology is increasing in various fields such as electronics industry. We have tried and experienced various sorts of lamination and we can meet your needs of lamination. ◆Lamination process of heat spreader and various substrates ◆Lamination process of polyimide tape and QFN lead frame ◆Lamination process of adhesive tape for semiconductor package.

	● We can laminate all tapes of room temperature type, thermoset type or thermoplasticity type. ● We can accept customer's order from 1 unit to mass production. ● We can select best adhesion tape for your applications. ● We ensure thorough control of moisture absorbent. (We control time while TAB is out of drying box)

	【Lamination process of heat spreader and various substrates】
		Process size / Capability Items Process size/Ability Length 120〜250 mm Width 25〜70 mm Thickness 0.1〜1.0 mm PKS size MAX50 mm Capacity / month TAB substrate : approx 400kpcs Rigid substrate : approx100kpcs Accuracy of position MAX0.1 mm Process size / Capability Items Process size/Ability Length 50〜250 mm Width 25〜70 mm Thickness 0.1〜1.0 mm Accuracy of position MAX0.5 mm
	【Lamination process of polyimide tape for lead frame of QFN】

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