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Last update 2010.6.4

	Advantageous Substrate Technologyfor Module Miniaturization Glass-ceramics are fired under 1000 degrees, therefore Ag, AgPd and Au can be used as co-fired inner conductor. In addition, the signal delay becomes shorter due to low dielectric constant which is lower than Alumina substrates. Because thermal expansion coefficient of LTCC is similar to silicon, it is easy to bond die directly to the pad or to be connected flip chip.

	↑ 19 layers

♦ Standard Value of Ceramic Process Item Standard(Custom) Dielectric Layers Outer Size(mm) ≤ 120 (180) Thickness / Layer (mm) 0.05 - 0.3 ≤ 3.5 TOTAL Total Layers ≤ 10 (30) Dev. X - Y ± 0.5% (0.2) Z ± 10% (6) Warp 10μm / 10mm (Ra) = Roughness(Ra) 0.5μm (As Sintered) 0.05μm (Treatment) Inner Pattern Width (mm) ≥ 0.1 (0.05) Line Spacing (mm) ≥ 0.1 (0.05) Via Diameter (mm) ≥ 0.1 (0.08) Via Spacing (mm) ≥ 0.1 (0.05) Surface Pattern Width (mm) ≥ 0.1 (0.05) Line Spacing (mm) ≥ 0.1 (0.05) Plating Ni (μm) 3.0 - 5.0 Au (μm) 0.2 - 0.6

Downloads

Hirai Precision LTCC 2011 (PDF)

Design Guide Lines for LTCC (PDF)

Design Kit for Agilent ADS (zip)

Installation manual of HIRAI LTCC for Design Kit (PDF)

Hirai Precision LTCC 2010 (PDF)

Hirai Precision LTCC 2009 (PDF)

Hirai Precision LTCC 2008 (PDF)

Hirai Precision LTCC 2007 (PDF)

Hirai Precision LTCC 2006 (PDF)

Thick Leadframe for Power Devices(PDF)

EuMW 2008

EuMW Paper

Multi-strip LTCC resonator BPF

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