Consistent production system for various plating process
We established the production systems which are able to handle various plating types. Furthermore, we also have the selective Ag plating line for leadframe.
We can provide consistent service from etching to selective Ag plating and downset process.
Plating Process
Full plating, Au, Ag, Cu, Ni, Pd, Sn plating and selective plating are available.
We can also offer other plating requirements such as selective Ni, stripe Ni, selective Ag with small area,and other various plating demands
Soft Etching Process(Overall Etching Process)
It can be used to make the metal surface dull and textured surface which improve adhesion with resin.This process is also able to remove edges and make them smooth.
Electropolish process
This process make the stainless steel surface smooth with brightness.Application of this process has many ways such as “Want brightness” or “Want to remove roughness of material surface” etc.
Chemical Polishing Process
Material have more luster than original material surface by chemically corrode.It can be used for removing burrs of stamped parts.This process is FAI only.
Blasting Process
Light shielding is made by making material surface rough.This process can expect anchor effect which is necessary for assemble the parts.
Black Oxide Process
Black oxide layer is formed on metal surface. It is effective for antireflection and improvement of durability. This process is available for both SUS series and Cu series.
Surface brightness can be increased by adding blasting process on the black oxide surface.
Standard specification of Plating
| Plating | Overall plating Max. processing size (mm) |
Selective plating |
|---|---|---|
| Electrolyric Ni(Semi-bright) | 450×450 | 〇 |
| Electrolyric Ni(bright) | 500×500 | 〇 |
| Electroless Ni | 350×350 | ✕ |
| Electroless Ni(Black) | Need to be discussed | － |
| Electroless Ni-PTFE | Need to be discussed | － |
| Soft Au | 350×350 | △（Plating thickness : max. 0.2μ） |
| Hard Au | 350×350 | 〇 |
| Electroless Au | Need to be discussed | 〇 |
| Ag(Bright/Dull) | 500×500 | 〇 |
| Ag(Semi-bright) | 260×80 | 〇 Only selective plating |
| Ag(Dull) | 450×450 | 〇 |
| Cu(Dull) | 500×500 | Need to be discussed |
| Cu(Semi-bright) | 450×450 | Need to be discussed |
| Cu(Bright)Acid | 500×300 | 〇 |
| Sn(Dull) | 500×500 | Need to be discussed |
| Sn(bright) | 450×450 | Need to be discussed |
| Pd(Dull) | 450×450 | ✕ |
| PPF(Ni/Pd/Au) | 500×300 | ✕ |