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	Consistent production system fulfills various demands. Accurate and quick service is available through consistent production system including post etching process such as selective plating, chemical polishing, black oxide or blasting finish which enhance the quality of etched parts. We can meet from trial products to various demands.

We established the rack plating system, which gives various plating service. Furthermore, we also have the selective Ag plating line for leadframes. We can provide consistent service from etching to selective Ag plating and downset process. 【Au plating】 【NiPdAu plating】

【Selective Ag plating】】 ●Standard specification of Plating Plating Specification Max. processing size (mm) of rack plating） Availability of selective plating Electrolyric Ni (Semi-bright) 450×450 ○ Electroless Ni 350×350 × Soft Au 350×350 △（Plating thickness : max. 0.2μ） Hard Au 350×350 ○ Ag (Dull) 450×450 ○ Ag (Bright) 450×450 ○ Cu (Semi-bright) 450×450 × Sn (Dull) 350×430 ○ Sn (bright) 350×430 ○ Pd (Dull) 350×350 ○

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	This process gives even brightness on surface and makes edged end face round by soaking stainless material into chemical polishing solution. Max. processing size is 300mmX300mm.		Soft etching process makes surface rough by etching all over the parts using etchant. This can be applied to the etched products after the removal of photo resist or the products produced by cutting or other machining processes. If surface with antireflection or rounded end face is required, this process is also applicable for the purpose of effect by chemical polishing.

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	Sandblast process is available with using alumina ceramics and glass beads etc. It is effective to restrain surface brightness or to increase plating surface area as preconditioning of plating.		Black oxide layer is formed on metal surface. It is effective for antireflection and improvement of durability. This process is available for both SUS series and Cu series. Surface brightness can be increased by adding blasting process on the black oxide surface.

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