Etching + Bending

[Bending process]

Bending is a processing technique to bend metal materials into various shapes using a die.  We can provide added value to your products by performing this bending process after etching.  Metals have the property of not returning to their original shape when a certain amount of force is applied to them (plasticity) .  This property is utilized for bending process.  We can create your requested shape by bending the products made by etching process.

We manufacture terminals according to customer requests, including single pin terminal, lead pins, flanged terminals, crushed terminals, and terminals bent at 90 degrees.  We can manufacture customized products according to your application or purpose, such as pin terminals and lead pins for substrates and molded products.  We accept an order from just one piece.  Dies required for bending are customized simple dies for small volume, and they are not as expensive as large press machine.

[Application example: Connectors]

Connector is a part used for electrically connecting two circuits or components.  They are incorporated inside of a wide variety of products, including electronic devices, home appliances, industrial machinery, automobiles, and communication peripherals.

The parts that compose a connector are known as several names, such as “terminals,” “pins,” and “contacts.”  We also assist with PCB connectors used in mobile devices such as smartphones, and narrow-pitch connector terminals that require high processing accuracy, such as FPC connectors.  It is also often used in automotive terminals.  Cu-based base materials are mainly used.

[ Application example: Terminals of crystal unit]

A quartz crystal unit is also called hermetic seal.  This is a sealed terminal for electronic components with an airtight structure sealed with glass and metal.  Main applications include quartz devices, high-frequency components, semiconductor lasers and various sensors.  The material that is mainly used is Kovar (a nickel-iron alloy), which has a similar thermal expansion coefficient that of hard glass at room temperature.

[Application example: Terminals for power semiconductors]

Terminals for power semiconductors are often processed with wire bonding of gold etc.  Plating is required as a surface treatment to improve bondability.  Therefore, we can also provide etching + plating + bending.  

We are capable of etching on SUS (stainless steel), Cu (copper), Fe (iron), AI (aluminum), Ni alloys (Kovar, 42 alloy, amber), and also special materials such as silicon steel plate, Ag (silver), Ti, amorphous, and permalloy.  Bending after etching is also available upon request.